MATERIAL:FR4, HIGH TG FR4, HALOGEN FREE FR4, CEM3, CEM1, ETC.
LINE WIDTH/SPACING:0.003”/0.003”(0.075mm/0.075mm)
MIN HOLE SIZE:0.008”(0.20mm)
ASPECT RATIO:8.0
BOARD THICKNESS:0.010”~0.125”(0.25mm~3.12mm)
MIN SMD PITCH:0.016”(0.40mm)
LAYER COUNTS:1~16 LAYERS
FINISHED COPPER THICKNESS:0.5~4OZ
SOLDERMASK COLOR:GREEN, BLUE , RED , YELLOW, WHITE AND BLACK.ETC.
LENEND COLOR:WHITE , YELLOW , BLACK , ETC.
FINISHED SURFACE:HAL, HAL LEADFREE, ENIG , IMMERSION TIN, IMMERSION SILVER, OSP.
WARP AND TWIST:0.7%MAX
MAX BOARD SIZE:550x600mm
MIN BOARD THICKNESS:
2L-0.2±0.10mm
4L-0.4±0.10mm
6L-0.6±0.10mm
8L-1.0±0.10mm
10L-1.0±0.10mm
12L-1.2±0.12mm
MIN SOLDER MASK BRIDGE:4mil (MIN SMT PAD SPACE 8mil)
MIN CONTOUR TOLERANCE:+/-0.1mm